Module/Chip Level Coater "CL Series"
For semiconductor back-end processes and electronic component assembly processes! Contributes to high quality, high reliability, and improved productivity.
The "CL Series" is a chip-level coater that accommodates semiconductor chips, electronic components, and modules. It is capable of applying various shapes such as dots, lines, bezels, pillars, circles, and solid fills. In addition, we also offer the "CL Series," which can handle 4, 6, 8, and 12-inch wafers and glass substrates, as well as the "ES Series," which is compatible with 4-inch wafers and various types of workpieces. [Supported Features (Partial)] ■ High throughput ■ Guard ring and dam formation ■ Sealing of chips, electrodes, etc. ■ High viscosity liquids (1000 Pa·s or more) ■ Full wafer/dot/line coating *For more details, please refer to the PDF materials or feel free to contact us.
- Company：エンジニアリング・ラボ 本社、テクニカルセンター、品川ショールーム
- Price：Other
